Special issue of MSSP

Authors of accepted abstracts are encouraged to submit their original papers on the significant part of their work presented at ISCSI-VIII to the special issue of Materials Science in Semiconductor Processing, published by Elsevier.

https://www.journals.elsevier.com/materials-science-in-semiconductor-processing/

The submission site will open on Nov. 1, 2019. The deadline of the paper submission is Dec 15, 2019.

Each paper will be published online soon after its acceptance by completing the review process.

To start the submission process, authors should sign in for the following site with your EVISE or Elsevier profile. After signing in please select the special issue name as “VSI:ISCSI-VIII”.

https://www.evise.com/profile/#/MSSP/login

Those who wish to submit to this special issue should read through the following instructions for preparing manuscripts. Note that the manuscript will be published after the usual reviewing process of MSSP.

http://www.elsevier.com/wps/find/journaldescription.cws_home/600849?generatepdf=true

The publication charges of all accepted articles in this special issue will be covered by the conference. Authors also have the option to select Open Access on their individual articles with corresponding fees. (If you do not choose this option there is no publication charge) You are not eligible for the submission to this special issue without presentation at the conference.

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